Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424602 | Bonded assembly containing conductive via structures extending through word lines in a staircase region and methods for making the same | Masanori Tsutsumi, Hiroyuki Ogawa | 2025-09-23 |