Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341074 | Semiconductor package with increased thermal dissipation | Myungkee Chung, Aenee Jang | 2025-06-24 |
| 12237290 | Semiconductor packages and methods of manufacturing the semiconductor packages | Aenee Jang | 2025-02-25 |