Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347819 | Semiconductor package having stacked semiconductor chips | Seungduk Baek | 2025-07-01 |
| 12341074 | Semiconductor package with increased thermal dissipation | Younglyong Kim, Myungkee Chung | 2025-06-24 |
| 12237290 | Semiconductor packages and methods of manufacturing the semiconductor packages | Younglyong Kim | 2025-02-25 |
| 12191238 | Semiconductor package | — | 2025-01-07 |