Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394708 | Semiconductor package | Myungsam Kang, Jeongseok Kim, Bongju Cho | 2025-08-19 |
| 12334445 | Method of fabricating a semiconductor package | Myungsam Kang, Taesung Jeong | 2025-06-17 |
| 12327826 | Semiconductor package | Yongkoon Lee, Myungsam Kang | 2025-06-10 |
| 12278191 | Semiconductor packages having wiring patterns | Myungsam Kang, Jeongseok Kim, Bongju Cho | 2025-04-15 |
| 12261105 | Semiconductor package | Myungsam Kang, Jeongseok Kim, Kyung Don Mun, Bongju Cho | 2025-03-25 |