Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334445 | Method of fabricating a semiconductor package | Myungsam Kang, Youngchan Ko | 2025-06-17 |
| 12218099 | Interposer and semiconductor package including the same | Jungsoo Byun, Younggwan Ko, Jaeean Lee | 2025-02-04 |