Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400970 | Semiconductor package including electromagnetic shield structure | Jongwan Kim, Yongkwan Lee, Kyonghwan Koh, Seunghwan KIM, Jungjoo Kim +1 more | 2025-08-26 |
| 12308253 | Molded product for semiconductor strip and method of manufacturing semiconductor package | Seunghwan KIM, Kyonghwan Koh, Jungjoo Kim, Jongwan Kim, Junwoo Park +3 more | 2025-05-20 |
| 12205925 | Semiconductor package having package substrate | Yongkwan Lee, Seunghwan KIM, Jungjoo Kim, Jongwan Kim, Hyunki Kim +3 more | 2025-01-21 |