Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400970 | Semiconductor package including electromagnetic shield structure | Jongwan Kim, Kyonghwan Koh, Seunghwan KIM, Jungjoo Kim, Junwoo Park +1 more | 2025-08-26 |
| 12308253 | Molded product for semiconductor strip and method of manufacturing semiconductor package | Seunghwan KIM, Kyonghwan Koh, Jungjoo Kim, Jongwan Kim, Junwoo Park +3 more | 2025-05-20 |
| 12288743 | Semiconductor package | Junwoo Park, Seunghwan KIM, Jungjoo Kim, Dongju Jang | 2025-04-29 |
| 12205925 | Semiconductor package having package substrate | Seunghwan KIM, Jungjoo Kim, Jongwan Kim, Hyunki Kim, Junwoo Park +3 more | 2025-01-21 |