Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12256490 | Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor package | Mari SHIMIZU, Daisuke Fujimoto, Yasuo Kamigata, Tomohiko KOTAKE, Shin Takanezawa +3 more | 2025-03-18 |