Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12264224 | Maleimide resin composition, prepreg, laminated board, resin film, multilayer printed wiring board, and semiconductor package | Aya Kasahara, Tomohiko KOTAKE | 2025-04-01 |
| 12256490 | Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor package | Mari SHIMIZU, Yasuo Kamigata, Tomohiko KOTAKE, Shin Takanezawa, Akira Shimizu +3 more | 2025-03-18 |