Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12264224 | Maleimide resin composition, prepreg, laminated board, resin film, multilayer printed wiring board, and semiconductor package | Tomohiko KOTAKE, Daisuke Fujimoto | 2025-04-01 |