Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431457 | Electromagnetic shields with bonding wires for sub-modules | Jeffrey Miller, Joseph Edward Geniac, Rommel Quintero | 2025-09-30 |
| 12334413 | System in package with flip chip die over multi-layer heatsink stanchion | Jeffrey Miller, Mihir K. Roy, Christine Blair | 2025-06-17 |
| 12230895 | Reactance cancelling radio frequency circuit array | Nikolaus Klemmer, Jeffery Galipeau | 2025-02-18 |