Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431457 | Electromagnetic shields with bonding wires for sub-modules | Kelly M. Lear, Joseph Edward Geniac, Rommel Quintero | 2025-09-30 |
| 12334413 | System in package with flip chip die over multi-layer heatsink stanchion | Kelly M. Lear, Mihir K. Roy, Christine Blair | 2025-06-17 |