Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12233621 | Copper-clad laminated plate, resin-clad copper foil, and circuit substrate using said plate and foil | Yuki Kitai, Masashi Koda, Atsushi Wada, Mikio Sato | 2025-02-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12233621 | Copper-clad laminated plate, resin-clad copper foil, and circuit substrate using said plate and foil | Yuki Kitai, Masashi Koda, Atsushi Wada, Mikio Sato | 2025-02-25 |