Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12428534 | Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminated board, and wiring board | Atsushi Wada, Ryusei Kozawa, Yuki Kitai | 2025-09-30 |
| 12312452 | Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board | Atsushi Wada, Ryusei Kozawa, Yuki Kitai | 2025-05-27 |
| 12233621 | Copper-clad laminated plate, resin-clad copper foil, and circuit substrate using said plate and foil | Yuki Kitai, Yasunori HOSHINO, Atsushi Wada, Mikio Sato | 2025-02-25 |