Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12358084 | Bonding head and bonding apparatus | Andrej Kolbasow, Thorsten Krause, Svetlana Milz | 2025-07-15 |
| 12349287 | Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole | Andrej Kolbasow, Nico Lange | 2025-07-01 |