Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12349287 | Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole | Matthias Fettke, Andrej Kolbasow | 2025-07-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12349287 | Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole | Matthias Fettke, Andrej Kolbasow | 2025-07-01 |