Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406896 | Semiconductor device package having thermal dissipation feature and method therefor | Scott M. Hayes, Michael B. Vincent, Zhiwei Gong, Kabir Mirpuri, Betty Hill-Shan Yeung | 2025-09-02 |