Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406896 | Semiconductor device package having thermal dissipation feature and method therefor | Scott M. Hayes, Michael B. Vincent, Zhiwei Gong, Rushik P. Tank, Betty Hill-Shan Yeung | 2025-09-02 |
| 12199064 | Substrate pad and die pillar design modifications to enable extreme fine pitch flip chip (FC) joints | — | 2025-01-14 |