MR

Marcus Rinkiö

MC Murata Manufacturing Co.: 1 patents #354 of 930Top 40%
📍 Rajamäki, FI: #1 of 5 inventorsTop 20%
Overall (2025): #289,032 of 469,880Top 65%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12202725 Method for bonding wafers, and a wafer Konsta HANNULA, Teemu Vasara, Altti Torkkeli 2025-01-21