Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12202725 | Method for bonding wafers, and a wafer | Konsta HANNULA, Marcus Rinkiö, Teemu Vasara | 2025-01-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12202725 | Method for bonding wafers, and a wafer | Konsta HANNULA, Marcus Rinkiö, Teemu Vasara | 2025-01-21 |