Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12331182 | Resin composition and resin-attached copper foil | Haruka MAKINO, Kuniharu OGAWA | 2025-06-17 |
| 12331212 | Resin composition, copper foil with resin, and printed wiring board | Ayumu Tateoka, Kuniharu OGAWA, Haruka MAKINO | 2025-06-17 |