Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12331212 | Resin composition, copper foil with resin, and printed wiring board | Kazuhiro OOSAWA, Kuniharu OGAWA, Haruka MAKINO | 2025-06-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12331212 | Resin composition, copper foil with resin, and printed wiring board | Kazuhiro OOSAWA, Kuniharu OGAWA, Haruka MAKINO | 2025-06-17 |