Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347732 | Systems and methods for mitigating crack propagation in semiconductor die manufacturing | Wei Yeeng Ng, Rajesh Balachandran, Frank Speetjens, Andrew Li, Sukhdeep Kaur | 2025-07-01 |