Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347732 | Systems and methods for mitigating crack propagation in semiconductor die manufacturing | Wei Yeeng Ng, Rajesh Balachandran, Frank Speetjens, Sukhdeep Kaur, Sangeetha P. Komanduri | 2025-07-01 |
| 12256546 | Integrated assemblies and methods of forming integrated assemblies | Yiping Wang, Haoyu Li, Matthew J. King, Wei Yeeng Ng, Yongjun Jeff Hu | 2025-03-18 |
| 12200929 | Integrated circuitry comprising a memory array comprising strings of memory cells and method used in forming a memory array comprising strings of memory cells | Collin Howder, M. Jared Barclay, Bhavesh Bhartia, Chet E. Carter, John D. Hopkins +3 more | 2025-01-14 |