Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406960 | Method of manufacturing laminate by sinter- bonding semiconductor chip and substrate | Hidekazu Nakayama, Yosuke Sato | 2025-09-02 |
| 12288768 | Method of manufacturing laminate | Hidekazu Nakayama, Yosuke Sato | 2025-04-29 |