HN

Hidekazu Nakayama

LI Lintec: 2 patents #1 of 28Top 4%
Overall (2025): #122,068 of 469,880Top 30%
2
Patents 2025

Issued Patents 2025

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
12406960 Method of manufacturing laminate by sinter- bonding semiconductor chip and substrate Isao Ichikawa, Yosuke Sato 2025-09-02
12288768 Method of manufacturing laminate Isao Ichikawa, Yosuke Sato 2025-04-29