Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12286564 | Adhesive composition for semiconductor circuit connection, adhesive film for semiconductor, method for manufacturing semiconductor package, and semiconductor package using the same | Youngsam KIM, Kwang Joo Lee, Minsu Jeong, Junghak Kim, Ju Hyeon KIM | 2025-04-29 |