Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12378447 | Semiconductor adhesive composition and semiconductor adhesive film comprising cured product thereof | Eun-Bum Kim, Jung Hak Kim, Ju Hyeon KIM, Yoon Sun Jang | 2025-08-05 |
| 12341033 | Apparatus for separating semiconductor chip and method for separating semiconductor by using same | Eun-Bum Kim, Ju Hyeon KIM, Jung Hak Kim, Yoon Sun Jang | 2025-06-24 |
| 12286564 | Adhesive composition for semiconductor circuit connection, adhesive film for semiconductor, method for manufacturing semiconductor package, and semiconductor package using the same | Youngsam KIM, You-Jin Kyung, Minsu Jeong, Junghak Kim, Ju Hyeon KIM | 2025-04-29 |