Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431406 | Bonded body, circuit board, semiconductor device, and method for manufacturing bonded body | Maki Yonetsu, Sachiko FUJISAWA | 2025-09-30 |
| 12343820 | Brazing material, bonded body, ceramic circuit board, and method for manufacturing bonded body | Maki Yonetsu, Sachiko FUJISAWA, Takashi Sano | 2025-07-01 |
| 12347744 | Bonded body including titanium alloy at bonding boundary | Maki Yonetsu, Sachiko FUJISAWA | 2025-07-01 |
| 12240218 | Bonded assembly, and ceramic circuit substrate and semiconductor device using the same | Shota YAMAMOTO, Fumihiko Yoshimura, Tomoyuki Oozeki | 2025-03-04 |