Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431406 | Bonded body, circuit board, semiconductor device, and method for manufacturing bonded body | Seiichi Suenaga, Sachiko FUJISAWA | 2025-09-30 |
| 12343820 | Brazing material, bonded body, ceramic circuit board, and method for manufacturing bonded body | Seiichi Suenaga, Sachiko FUJISAWA, Takashi Sano | 2025-07-01 |
| 12347744 | Bonded body including titanium alloy at bonding boundary | Seiichi Suenaga, Sachiko FUJISAWA | 2025-07-01 |
| 12308301 | Structure and bonded body | Yumi Fukuda, Koichi Harada, Kenji Essaki, Yasushi Hattori, Yasuhiro Goto +1 more | 2025-05-20 |