Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394627 | Substrate polishing system | Hee Sung Chae, Geun Sik Yun | 2025-08-19 |
| 12293996 | Semiconductor package including heat dissipation structure | Moon Hee Yi, Yong Hoon Kim | 2025-05-06 |
| 12295100 | Printed circuit board including bonding layer, having conductive particles, disposed between core portions | Sang Yoon Lee | 2025-05-06 |
| 12186900 | Substrate cleaning line and substrate cleaning system comprising the same | Hee Sung Chae, Geun Sik Yun | 2025-01-07 |