Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12432849 | Flip-chip bonding structure and circuit board thereof | Chun-Te Lee, Chih-Ming Peng, Hui-Yu Huang | 2025-09-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12432849 | Flip-chip bonding structure and circuit board thereof | Chun-Te Lee, Chih-Ming Peng, Hui-Yu Huang | 2025-09-30 |