CL

Chun-Te Lee

CT Chipbond Technology: 1 patents #4 of 21Top 20%
Overall (2025): #425,595 of 469,880Top 95%
1
Patents 2025

Issued Patents 2025

Patent #TitleCo-InventorsDate
12432849 Flip-chip bonding structure and circuit board thereof Chih-Ming Peng, Pi-Yu Peng, Hui-Yu Huang 2025-09-30