Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347742 | IC package with heat spreader | Rongwei Zhang, Woochan Kim | 2025-07-01 |
| 12255115 | Electronic devices in semiconductor package cavities | Christopher Daniel Manack, Qiao Chen | 2025-03-18 |