Issued Patents 2025
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412838 | Integrated circuit structure with filled recesses | Kevin Lin, James M. Blackwell, Rami Hourani | 2025-09-09 |
| 12341092 | Planar slab vias for integrated circuit interconnects | Elijah V. Karpov, Manish Chandhok | 2025-06-24 |
| 12293913 | Directed self-assembly enabled subtractive metal patterning | Gurpreet Singh, Richard E. Schenker, Nityan NAIR, Gauri Nabar, Eungnak Han +7 more | 2025-05-06 |
| 12266527 | Directed self-assembly enabled patterning over metal layers using assisting features | Gurpreet Singh, Nityan NAIR, Eungnak Han, Xuanxuan Chen, Brandon Holybee +6 more | 2025-04-01 |
| 12266729 | Angled etch to enable tin removal from selected sidewalls | Shriram Shivaraman, Seung Hoon Sung, Uygar E. Avci | 2025-04-01 |
| 12261114 | Metallization stacks with self-aligned staggered metal lines | Elijah V. Karpov, Christopher J. Jezewski, Manish Chandhok, Matthew V. Metz | 2025-03-25 |