Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341117 | Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates | Hongxia Feng, Xiaoying Guo, Steve Cho, Jung Kyu Han, Changhua Liu +4 more | 2025-06-24 |
| 12334422 | Methods and apparatus to reduce defects in interconnects between semicondcutor dies and package substrates | Onur Ozkan, Ali Lehaf, Xiaoying Guo, Steve Cho, Leonel Arana +4 more | 2025-06-17 |