Issued Patents 2025
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424517 | Monolithic conductive cylinder in a semiconductor device and associated methods | Wei Zhou, Bret K. Street, Kunal R. Parekh | 2025-09-23 |
| 12424516 | Monolithic conductive column in a semiconductor device and associated methods | Wei Zhou, Bret K. Street, Kunal R. Parekh | 2025-09-23 |
| 12381131 | Front end of line interconnect structures and associated systems and methods | Kunal R. Parekh | 2025-08-05 |
| 12368096 | Microelectronic devices with through-substrate interconnects and associated methods of manufacturing | Kunal R. Parekh, Sarah A. Niroumand | 2025-07-22 |
| 12368131 | Embedded nanoparticles for on-die thermal enhancement of hybrid bonding and associated systems and methods | Bang-Ning Hsu, Byung Hoon Moon | 2025-07-22 |
| 12334469 | Piezoelectric materials for on-die thermal enhancement of hybrid bonding and associated systems and methods | Byung Hoon Moon | 2025-06-17 |
| 12334448 | Front end of line interconnect structures and associated systems and methods | Kunal R. Parekh | 2025-06-17 |
| 12308348 | Multi-height interconnect structures and associated systems and methods | — | 2025-05-20 |
| 12300570 | Grindable heat sink for multiple die packaging | Wei Zhou, Bret K. Street | 2025-05-13 |
| 12191162 | Semiconductor device assembly with pillar array | Owen R. Fay, Akshay N. Singh | 2025-01-07 |