Issued Patents 2025
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424518 | Capacitor embedded 3D resonator for broadband filter | Je-Hsiung Lan, Kai Liu, Ranadeep Dutta | 2025-09-23 |
| 12400966 | Package comprising integrated devices and bridge coupling top sides of integrated devices | Bharani Chava, Abinash ROY, Stanley Seungchul Song | 2025-08-26 |
| 12395152 | Compact hybrid acoustic wave filter structure | Je-Hsiung Lan, Nosun PARK, Jui-Yi Chiu, Kai Liu | 2025-08-19 |
| 12354948 | Integrated device and integrated passive device comprising magnetic material | Kai Liu, Roy Chiu, Nosun PARK, Je-Hsiung Lan | 2025-07-08 |
| 12334903 | Substrate comprising acoustic resonators configured as at least one acoustic filter | Je-Hsiung Lan, Ranadeep Dutta | 2025-06-17 |
| 12300655 | Integrated circuit assembly with hybrid bonding | Milind Shah, Periannan Chidambaram, Abdolreza Langari | 2025-05-13 |
| 12283607 | 3D inductor design using bundle substrate vias | Je-Hsiung Lan, Ranadeep Dutta | 2025-04-22 |
| 12273095 | Wideband filter with resonators and inductors | Kai Liu, Rui Tang, Changhan Hobie Yun, Mario Francisco Velez | 2025-04-08 |
| 12253885 | Electronic device including flexible display | Joungmin CHO, Sungdae CHOI, Kwangtai KIM, Donghyun YEOM | 2025-03-18 |
| 12255381 | Antenna modules employing three-dimensional (3D) build-up on mold package to support efficient integration of radio-frequency (RF) circuitry, and related fabrication methods | Ranadeep Dutta, Je-Hsiung Lan | 2025-03-18 |
| 12218041 | Integrated circuit (IC) packages employing a capacitor-embedded, redistribution layer (RDL) substrate for interfacing an IC chip(s) to a package substrate, and related methods | Jihong Choi, Giridhar Nallapati, William Stone, Jianwen Xu, Periannan Chidambaram +1 more | 2025-02-04 |
| 12206155 | Radio frequency oscillator with ceramic resonator and surface-mounted integrated circuit package | Kai Liu, Jui-Yi Chiu, Nosun PARK, Je-Hsiung Lan | 2025-01-21 |