Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12211821 | Package-on-package assembly with wire bond vias | Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2025-01-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12211821 | Package-on-package assembly with wire bond vias | Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2025-01-28 |