WW

Wei-Shun Wang

AT Adeia Semiconductor Bonding Technologies: 1 patents #22 of 42Top 55%
📍 Palo Alto, CA: #598 of 1,602 inventorsTop 40%
🗺 California: #19,344 of 55,090 inventorsTop 40%
Overall (2025): #176,301 of 469,880Top 40%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12211821 Package-on-package assembly with wire bond vias Ellis Chau, Reynaldo Co, Roseann Alatorre, Philip Damberg, Se Young Yang 2025-01-28