DH

Daisuke HIEDA

SU Sumco: 1 patents #6 of 54Top 15%
Overall (2025): #412,874 of 469,880Top 90%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12400909 Method for producing support substrate for bonded wafer, and support substrate for bonded wafer Naoya NONAKA, Hiroaki ISHIZAKI, Toshiyuki Isami, Koudai Moroiwa 2025-08-26