Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400909 | Method for producing support substrate for bonded wafer, and support substrate for bonded wafer | Daisuke HIEDA, Hiroaki ISHIZAKI, Toshiyuki Isami, Koudai Moroiwa | 2025-08-26 |