Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347784 | Interposer with step feature | Florence R. Pon | 2025-07-01 |
| 12266591 | Choked flow cooling | Mark Forsnes, Yuhong Cai, Florence R. Pon | 2025-04-01 |
| 12237300 | Through-substrate void filling for an integrated circuit assembly | Tyler Leuten, Eleanor Patricia Paras Rabadam | 2025-02-25 |