TL

Tyler Leuten

IN Intel: 1 patents #1,527 of 3,896Top 40%
Overall (2025): #184,811 of 469,880Top 40%
1
Patents 2025

Issued Patents 2025

Patent #TitleCo-InventorsDate
12237300 Through-substrate void filling for an integrated circuit assembly Yi Xu, Eleanor Patricia Paras Rabadam 2025-02-25