Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431450 | Device including semiconductor chips and method for producing such device | Petteri Palm | 2025-09-30 |
| 12394697 | Method for fabricating a semiconductor device package comprising a pin in the form of a drilling screw | Thomas Bemmerl, Martin Gruber, Thorsten Meyer, Frank Singer | 2025-08-19 |
| 12249561 | Semiconductor device arrangement with compressible adhesive | Frank Singer | 2025-03-11 |
| 12218098 | Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate | Petteri Palm, Ralf Wombacher | 2025-02-04 |
| 12211824 | Power semiconductor package having first and second lead frames | Ivan Nikitin, Marco Bäßler, Andreas Grassmann, Waldemar Jakobi | 2025-01-28 |