RW

Ralf Wombacher

Infineon Technologies Ag: 1 patents #187 of 674Top 30%
📍 Burglengenfeld, DE: #2 of 7 inventorsTop 30%
Overall (2025): #243,842 of 469,880Top 55%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12218098 Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate Petteri Palm, Thorsten Scharf 2025-02-04