WB

Wiren D. Becker

IBM: 1 patents #1,197 of 3,866Top 35%
📍 Hyde Park, NY: #3 of 6 inventorsTop 50%
🗺 New York: #2,841 of 9,062 inventorsTop 35%
Overall (2025): #175,441 of 469,880Top 40%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12266598 Dense via pitch interconnect to increase wiring density Francesco Preda, Sungjun Chun, Jose A. Hejase, Junyan Tang, Pavel Roy Paladhi +2 more 2025-04-01