Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266598 | Dense via pitch interconnect to increase wiring density | Francesco Preda, Sungjun Chun, Jose A. Hejase, Pavel Roy Paladhi, Nam H. Pham +2 more | 2025-04-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266598 | Dense via pitch interconnect to increase wiring density | Francesco Preda, Sungjun Chun, Jose A. Hejase, Pavel Roy Paladhi, Nam H. Pham +2 more | 2025-04-01 |