Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354967 | Chip package assembly, electronic device, and preparation method of chip package assembly | Xiaojing Liao, Hao Peng | 2025-07-08 |
ZH
Zhaozheng Hou
Overall (2025): #150,849 of 469,880Top 35%
1
Patents 2025