Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12396093 | Power supply module and power device | Hao Peng | 2025-08-19 |
| 12354967 | Chip package assembly, electronic device, and preparation method of chip package assembly | Zhaozheng Hou, Hao Peng | 2025-07-08 |
| 12224146 | Embedded substrate, circuit board assembly, and electronic device | Chao Shen, Zhiqiang Xiang | 2025-02-11 |